Vapor etching of ion tracks in fused silica

被引:33
作者
Musket, RG
Yoshiyama, JM
Contolini, RJ
Porter, JD
机构
[1] Lawrence Livermore Natl Lab, Livermore, CA 94550 USA
[2] Candescent Technol Corp, San Jose, CA 95119 USA
关键词
D O I
10.1063/1.1467402
中图分类号
O59 [应用物理学];
学科分类号
摘要
We have used vapor etching of ion tracks to create high aspect ratio (i.e., length much greater than diameter), isolated cylindrical holes through similar to600-nm-thick films of thermally fused silica on silicon. Samples were exposed to the vapor from water-based liquids with various HF and HF+HCl concentrations. Independent control of the temperatures of the vapor and the samples provided the means to vary separately the etching rates for the tracks and the track-free material. The very rapid etching of the small latent track zone can be explained by preferential capillary condensation. Holes with diameters of similar to24 to similar to80 nm have been documented with length/diameter ratios of up to 22. Although we have restricted this study to thin-film silica, we have evidence that such holes are also formed in bulk fused silica. (C) 2002 American Institute of Physics.
引用
收藏
页码:5760 / 5764
页数:5
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