Resist materials for 157-nm lithography

被引:38
作者
Toriumi, M [1 ]
Ishikawa, S [1 ]
Miyoshi, S [1 ]
Naito, T [1 ]
Yamazaki, T [1 ]
Watanabe, M [1 ]
Itani, T [1 ]
机构
[1] Selete, Adv Technol Res Dept, Totsuka Ku, Yokohama, Kanagawa 2440817, Japan
来源
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVIII, PTS 1 AND 2 | 2001年 / 4345卷
关键词
157-nm lithography; fluoropolymer; photoresist; aqueous base solubility; chemical amplification;
D O I
10.1117/12.436868
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Fluoropolymers are key materials for single layer resists of 157-nm lithography. We have been studying fluoropolymers to identify their potential for base resins of 157-nm photoresist. Many fluoropolymers showed high optical transparencies, with absorption coefficients of 0.01 mum(-1) to 2 mum(-1) at 157 nm, and dry-etching resistance comparable to an ArF resist, and non-swelling solubility in the standard developer. Positive-tone resists were formulated using fluoropolymers that fulfill practical resist requirements. They showed good sensitivities, from I mJ/cm(2) to 10 mJ/cm(2), and contrast in the sensitivity curves. They were able to be patterned using a F-2 laser microstepper.
引用
收藏
页码:371 / 378
页数:8
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