Design and fabrication of an angular microactuator for magnetic disk drives

Angular electrostatic microactuators suitable for use ill a two-stage servo system for magnetic dish drives have been fabricated from molded chemical-vapor-deposited (CVD) polysilicon using the HexSil process. A 2.6-mm-diameter device has been shown to be capable of positioning the read/write elements of a 30% picoslider over a +/-1-mu m range, with a predicted bandwidth of 2 kHz, The structures are formed by depositing polysilicon via CVD into deep trenches etched into a silicon mold wafer. Upon release, the actuators are assembled onto a target wafer using a solder bond. The solder-bonding process will provide easy integration of mechanical structures with integrated circuits, allowing separate optimization of the circuit and structure fabrication processes. An advantage of HexSil is that once the mold wafer has undergone the initial plasma etching, it may be reused for subsequent polysilicon depositions, amortizing the cost of the deep-trench etching over many structural runs and thereby significantly reducing the cost of finished actuators. Furthermore, 100-mu m-high structures may be made from a 3-mu m deposition of polysilicon, increasing overall fabrication speed.