Blisters in as-deposited films of bcc stainless steel

被引：17

作者：

Eymery, JP

Denanot, MF

机构：

[1] Lab. de Métallurgie Physique, Université de Poitiers, 86022 Poitiers Cédex

来源：

SURFACE & COATINGS TECHNOLOGY | 1996年 / 80卷 / 03期

关键词：

thin films; stainless steel; residual stress; blisters; scanning electron microscopy;

D O I：

10.1016/0257-8972(95)02466-2

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Spontaneous delamination of thin stainless steel films on Si{100} wafers is reported. The films were deposited using an ion beam technique and were 0.5 mu m thick with a residual compressive stress of 2.2 GPa. Analysis of blisters in spontaneously delaminated films using simple models gives a satisfactory estimate of the residual stress. The possibility of utilizing the buckling patterns to determine the residual stress state in stainless steel films on Si substrates is then evaluated.

引用

收藏

页码：251 / 254

页数：4

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