Thermal Sensing With Lithographically Patterned Bimetallic Thin-Film Thermocouples

被引：17

作者：

Varrenti, Andrew R. ^{[1
]}

Zhou, Chuanle ^{[1
]}

Klock, A. Grace ^{[1
]}

Chyung, Seung H. ^{[1
]}

Long, Jieyi ^{[1
]}

Memik, Seda Ogrenci ^{[1
]}

Grayson, M. ^{[1
]}

机构：

[1] Northwestern Univ, Dept Elect Engn & Comp Sci, Evanston, IL 60208 USA

来源：

IEEE ELECTRON DEVICE LETTERS | 2011年 / 32卷 / 06期

基金：

美国国家科学基金会;

关键词：

Seebeck coefficient; thermal coefficient measurements; thermal sensing; thermocouple; thin-film devices; SEEBECK COEFFICIENT; CONDUCTIVITY; RESISTIVITY; CHROMIUM; VOLTAGE; SIZE;

D O I：

10.1109/LED.2011.2136314

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A chromium-nickel thin-film thermocouple that is 50 nm thick is demonstrated on a semiconductor substrate as proof of concept for lithographically processed bimetallic on-chip temperature sensors. The Seebeck coefficient of the thin-film thermocouple is calibrated to be 10.37 mu V/degrees C, reproducibly smaller than the bulk literature value by a factor of 3.98. The batch reproducibility of this thin-film Seebeck coefficient is demonstrated. The linear Seebeck response up to 90 degrees C is calibrated with the help of a simple formula which accounts for the temperature variations of the reference thermocouple under large heat loads.

引用

页码：818 / 820

页数：3

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