THERMOPOWER IN THIN-FILM COPPER-CONSTANTAN COUPLES

被引:73
作者
CHOPRA, KL
BAHL, SK
RANDLETT, MR
机构
[1] Ledgemont Laboratory, Kennecott Copper Corporation, Lexington, MA
关键词
D O I
10.1063/1.1656389
中图分类号
O59 [应用物理学];
学科分类号
摘要
The thickness dependence of the thermal emf of thin-film copper - constantan thermocouples at room temperature and above shows nearly bulklike behavior when the thickness of both elements comprising the thermocouple is greater than ∼1200 Å. The thermal response time of the thermocouples as measured with a pulsed laser beam heating source is less than 10-6 sec. The thickness-dependent contribution to the thermopower of copper films is deduced from the thermal emf data on thermocouples formed with a thick constantan film and compared with the size-effect theory based on the free-electron model. The marked thickness dependence observed yields anomalously high dependence (an order-of-magnitude higher) of the mean free path on the energy of electrons. This result is tentatively ascribed to the thermopower behavior of a transition layer formed by diffusion of the two components of the thermocouples. © 1968 The American Institute of Physics.
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页码:1525 / &
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