Investigation of the heel crack mechanism in Al connections for power electronics modules

被引：62

作者：

Celnikier, Y. ^{[1
,2
]}

Benabou, L. ^{[1
]}

Dupont, L. ^{[2
]}

Coquery, G. ^{[2
]}

机构：

[1] Univ Versailles St Quentin, LISV, F-78035 Versailles, France

[2] Inst Natl Rech Transports & Leur Securite, LTN, F-78000 Versailles, France

来源：

MICROELECTRONICS RELIABILITY | 2011年 / 51卷 / 05期

关键词：

WIRE BONDS; RELIABILITY;

D O I：

10.1016/j.microrel.2011.01.001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];

摘要：

In power electronic packages, one of the main limiting factors for the module reliability stems from failure of the electrical interconnection which ensures the contact between the chip and the lead frame. The aim of this work is to model, using FEM and some analytical developments, the interconnection heel crack mechanism appearing in service. The forming process impact is particularly evaluated and it is established that the initial residual stresses contribute to limit the wire/ribbon life time. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：965 / 974

页数：10

共 17 条

[1]

Selected failure mechanisms of modern power modules [J].

Ciappa, M .

MICROELECTRONICS RELIABILITY, 2002, 42 (4-5) :653-667

[2]

FBOUARROUDJ M, 2008, ETUDE FATIGUE THERMO, P66

[3]

HAMIDI A, 2004, P ECPE

[4]

Design concept for wire-bonding reliability improvement by optimizing position in power devices [J].

Ishiko, M ;

Usui, M ;

Ohuchi, T ;

Shirai, M .

MICROELECTRONICS JOURNAL, 2006, 37 (03) :262-268

[5]

Jung Ming Hu, 1991, Transactions of the ASME. Journal of Electronic Packaging, V113, P331, DOI 10.1115/1.2905416

[6]

LEMAITRE J, 2004, MECANIQUE MAT SOLIDE

[7]

Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method [J].

Liu, DS ;

Chao, YC ;

Wang, CH .

FINITE ELEMENTS IN ANALYSIS AND DESIGN, 2004, 40 (03) :263-286

[8]

LOH WS, 2008, 41 INT S MICR P IMAP

[9]

MEYYAPPAN KN, 2004, THESIS MARYLAND

[10]

MORELLE JM, 2009, P APE

← 1 2 →