The electropolymerization of pyrrole at a CuNi electrode: corrosion protection properties

被引:61
作者
Fenelon, AM [1 ]
Breslin, CB [1 ]
机构
[1] Natl Univ Ireland Maynooth, Dept Chem, Maynooth, Kildare, Ireland
关键词
polypyrrole; copper-nickel; corrosion protection; electropolymerization;
D O I
10.1016/S0010-938X(03)00104-5
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Pyrrole was successfully electropolymerized at a copper-nickel electrode in a near-neutral sodium oxalate solution containing Cu2+ cations to generate a homogenous and adherent polypyrrole film. The presence of the Cu2+ ions increased both the rate of the electropolymerization reaction and the adherence of the polymer at the CuNi interface. In the absence of these cations, oxidation of the electrode occurred generating a nickel-rich layer that was not sufficiently conducting, under the electropolymerization conditions employed, to facilitate the electron-transfer reaction and the electropolymerization of pyrrole. These films remained stable and exhibited significant corrosion protection properties in acidified and neutral 0.1 mol dm(-3) NaCl solutions even on polarization of the electrodes to high anodic potentials. (C) 2003 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2837 / 2850
页数:14
相关论文
共 27 条
[1]   Impedance and photoelectrochemical study of surface layers on Cu and Cu-10Ni in acetate solution containing benzotriazole [J].
Babic, R ;
Metikos-Hukovic, M ;
Loncar, M .
ELECTROCHIMICA ACTA, 1999, 44 (14) :2413-2421
[2]   Protection of iron against corrosion using a polyaniline layer I. Polyaniline electrodeposit [J].
Bernard, MC ;
Joiret, S ;
Hugot-Le Goff, A ;
Phong, PV .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (01) :B12-B16
[3]   Use of polyaniline and its derivatives in corrosion protection of copper and silver [J].
Brusic, V ;
Angelopoulos, M ;
Graham, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (02) :436-442
[4]   Characterization of polyaniline films electrodeposited on mild steel in aqueous p-toluenesulfonic acid solution [J].
Camalet, JL ;
Lacroix, JC ;
Aeiyach, S ;
Lacaze, PC .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1998, 445 (1-2) :117-124
[5]  
CHAGAS LV, 1995, ELECTROCHIM ACTA, V40, P1735
[6]   A surface analytical examination of passive layers on Cu/Ni alloys .1. Alkaline solution [J].
Druska, P ;
Strehblow, HH ;
Golledge, S .
CORROSION SCIENCE, 1996, 38 (06) :835-851
[7]   Surface analytical examination of passive layers on Cu-Ni alloys .2. Acidic solutions [J].
Druska, P ;
Strehblow, HH .
CORROSION SCIENCE, 1996, 38 (08) :1369-1383
[8]   The electrochemical synthesis of polypyrrole at a copper electrode: corrosion protection properties [J].
Fenelon, AM ;
Breslin, CB .
ELECTROCHIMICA ACTA, 2002, 47 (28) :4467-4476
[9]   An electrochemical study of the formation of Benzotriazole surface films on Copper, Zinc and a Copper-Zinc alloy [J].
Fenelon, AM ;
Breslin, CB .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 2001, 31 (05) :509-516
[10]   Electrochemical studies of propargyl alcohol as corrosion inhibitor for nickel, copper, and copper/nickel (55/45) alloy [J].
Gonçalves, RS ;
Azambuja, DS ;
Lucho, AMS .
CORROSION SCIENCE, 2002, 44 (03) :467-479