Thermal cure effects on electrical performance of nanoparticle silver inks

被引：253

作者：

Greer, Julia R. ^{[1
]}

Street, Robert A. ^{[1
]}

机构：

[1] Palo Alto Res Ctr, Palo Alto, CA 94304 USA

来源：

ACTA MATERIALIA | 2007年 / 55卷 / 18期

关键词：

nanoparticles; sintering; nano-inks;

D O I：

10.1016/j.actamat.2007.07.040

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Physical, electrical, and morphological properties of thermally annealed silver nanoparticle thin films are described. These solution deposited nanoparticle thin films form highly conducting films at low curing temperatures via sintering due to the high surface area to volume ratio. Measured resistivity correlates with thickness decrease and densification, and can be explained by a simple geometrical model applicable to the sintering process. Consideration of the active sintering mechanisms provides the basis for a phenomenological model predicting optimal pathways to achieve desired electrical performance. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：6345 / 6349

页数：5

共 17 条

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