Study on the growth of crack-free AlxGa1-xN (0.133≥x>0.1)/GaN heterostructure with low dislocation density

被引:8
作者
Cho, HK
Lee, JY
Choi, SC
Yang, GM
机构
[1] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Yusong Gu, Taejon 305701, South Korea
[2] Chonbuk Natl Univ, Dept Semicond Sci & Technol, Chungju 561756, South Korea
[3] Chonbuk Natl Univ, Semicond Phys Res Ctr, Chungju 561756, South Korea
关键词
AlxGa1-xN; TEM; crack; etching; threading dislocation; heterostructure;
D O I
10.1016/S0022-0248(00)00933-7
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
We have investigated the growth of crack-free AlxGa1-xN layer (0.133 greater than or equal to x > 0.1) with low dislocation density using AlxGa1-xN/GaN heterostructure. From the wet-etched surfaces and transmission electron microscopy (TEM) images, the 2 mum underlying AlxGa1-xN layer with low AIN molar fraction is effective in preventing the formation of cracks in AlxGa1-xN surface. Although the number of defects in the underlying AlxGa1-xN layer grown on low-temperature GaN buffer are increased by the increase of AIN molar fraction, the use of the highly strained AlxGa1-xN/GaN/AlxGa1-xN heterostructure on the underlying layer is effective in reducing the number of defects near the surface. The possibility of the growth of crack-free AlxGa1-xN/GaN heterostructure with low dislocation density by controlling the AIN molar fraction and the misfit strain value is presented. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:104 / 109
页数:6
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