A comparison of the properties of titanium-based films produced by pulsed and continuous DC magnetron sputtering

被引:86
作者
Kelly, PJ [1 ]
Beevers, CF
Henderson, PS
Arnell, RD
Bradley, JW
Bäcker, H
机构
[1] Univ Salford, Surface Engn Grp, Salford M5 4WT, Lancs, England
[2] UMIST, Dept Phys, Manchester M60 1QD, Lancs, England
关键词
titanium-based films; DC magnetron sputtering; film properties;
D O I
10.1016/S0257-8972(03)00356-6
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In the field of magnetron sputtering, it is well established that mid-frequency (20-350 kHz) pulsed processing offers many advantages over continuous DC processing for the reactive deposition of dielectric films. By periodically reversing the target voltage, arc events at the target are suppressed and the reactive sputtering process is stabilised. However, recent studies have shown that pulsing the discharge also significantly modifies the characteristics of the magnetron plasma. Specifically, increased plasma density and electron temperatures, and therefore increased ion energy fluxes to the growing film, have been measured. Clearly, this will have an impact on the properties of both insulating and conductive films. In this study, therefore, titanium dioxide and titanium nitride coatings were deposited by pulsed (asymmetric bipolar, 20-kHz pulse frequency) and continuous DC reactive sputtering. The coatings were characterised in terms of their structures and properties using a range of analytical and measurement techniques, including scanning electron microscopy, electron probe microanalysis, X-ray diffraction, micro-hardness testing, scratch adhesion testing, wear testing and surface profilometry. The optical properties of the TiO2 films were also investigated. In this case, the pulsed films showed increased refractive index and peak transmission values in comparison to the DC films, while the tribological properties of both coating types were superior when pulsed processing was used in comparison with continuous processing. (C) 2003 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:795 / 800
页数:6
相关论文
共 14 条
[1]   The distribution of ion energies at the substrate in an asymmetric bi-polar pulsed DC magnetron discharge [J].
Bradley, JW ;
Bäcker, H ;
Aranda-Gonzalvo, Y ;
Kelly, PJ ;
Arnell, RD .
PLASMA SOURCES SCIENCE & TECHNOLOGY, 2002, 11 (02) :165-174
[2]   Space and time resolved Langmuir probe measurements in a 100 kHz pulsed rectangular magnetron system [J].
Bradley, JW ;
Bäcker, H ;
Kelly, PJ ;
Arnell, RD .
SURFACE & COATINGS TECHNOLOGY, 2001, 142 :337-341
[3]   Time-resolved Langmuir probe measurements at the substrate position in a pulsed mid-frequency DC magnetron plasma [J].
Bradley, JW ;
Bäcker, H ;
Kelly, PJ ;
Arnell, RD .
SURFACE & COATINGS TECHNOLOGY, 2001, 135 (2-3) :221-228
[4]   Mid frequency sputtering - a novel tool for large area coating [J].
Brauer, G ;
Szczyrbowski, J ;
Teschner, G .
SURFACE & COATINGS TECHNOLOGY, 1997, 94-5 (1-3) :658-662
[5]   THE MECHANICAL AND TRIBOLOGICAL PROPERTIES OF TITANIUM ALUMINUM NITRIDE COATINGS FORMED IN A 4 MAGNETRON CLOSED-FIELD SPUTTERING SYSTEM [J].
EFEOGLU, I ;
ARNELL, RD ;
TINSTON, SF ;
TEER, DG .
SURFACE & COATINGS TECHNOLOGY, 1993, 57 (2-3) :117-121
[6]   The deposition of aluminium oxide coatings by reactive unbalanced magnetron sputtering [J].
Kelly, PJ ;
AbuZeid, OA ;
Arnell, RD ;
Tong, J .
SURFACE & COATINGS TECHNOLOGY, 1996, 86 (1-3) :28-32
[7]   Reactive pulsed magnetron sputtering process for alumina films [J].
Kelly, PJ ;
Henderson, PS ;
Arnell, RD ;
Roche, GA ;
Carter, D .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2000, 18 (06) :2890-2896
[8]   Enhanced mechanical seal performance through CVD diamond films [J].
Kelly, PJ ;
Arnell, RD ;
Hudson, MD ;
Wilson, AEJ ;
Jones, G .
VACUUM, 2001, 61 (01) :61-74
[9]   Characterisation studies of the pulsed dual cathode magnetron sputtering process for oxide films [J].
O'Brien, J ;
Kelly, PJ .
SURFACE & COATINGS TECHNOLOGY, 2001, 142 :621-627
[10]   The effect of substrate temperature and biasing on the mechanical properties and structure of sputtered titanium nitride thin films [J].
Patsalas, P ;
Charitidis, C ;
Logothetidis, S .
SURFACE & COATINGS TECHNOLOGY, 2000, 125 (1-3) :335-340