Thin film metallic glasses as new mems materials

被引:18
作者
Hata, S [1 ]
Sakurai, J [1 ]
Shimokohbe, A [1 ]
机构
[1] Tokyo Inst Technol, Precis & Intelligence Lab, Tokyo, Japan
来源
MEMS 2005 Miami: Technical Digest | 2005年
关键词
D O I
10.1109/MEMSYS.2005.1453971
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In order to apply the metallic glasses to MEMS, Pd-based, Zr-based and Cu-based thin film metallic glasses (TFMGs) are fabricated successfully using an RF magnetron sputtering system. The TFMGs exhibit high strength and high elastic limit at room temperature and low viscosity (under 10(13) Pa center dot s) at supercooled liquid region (SCLR). These characteristics are desirable for utilization of TFMGs as three-dimensional (3D) micro-elastic-mechanisms. 3D microstructures are realized by novel microforming methods at the SCLR. These methods can be divided into two categories, namely the 'deformation-heating method' and the 'heating-deformation method'. Using those new microforming methods, 3D MEMS made of TFMG with new shapes and functions are demonstrated.
引用
收藏
页码:479 / 482
页数:4
相关论文
共 11 条
[1]  
*FREED GROUP, 2004, STUD FOR 2008 2013
[2]  
FUKUSHIGE T, 2003, P SPIE INT S MICR ME, P181
[3]   Fabrication of thin film metallic glass and its application to microactuator [J].
Hata, S ;
Sato, K ;
Shimokohbe, A .
DEVICE AND PROCESS TECHNOLOGIES FOR MEMS AND MICROELECTRONICS, 1999, 3892 :97-108
[4]  
HATA S, 2003, P 2003 INT C MICR SY, P180
[5]  
HATA S, 2004, P EUSPEN GLASGOW 200, P9
[6]   AL-LA-CU AMORPHOUS-ALLOYS WITH A WIDE SUPERCOOLED LIQUID REGION [J].
INOUE, A ;
YAMAGUCHI, H ;
ZHANG, T ;
MASUMOTO, T .
MATERIALS TRANSACTIONS JIM, 1990, 31 (02) :104-109
[7]   Microforming of three-dimensional microstructures from thin-film metallic glass [J].
Jeong, HW ;
Hata, S ;
Shimokohbe, A .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2003, 12 (01) :42-52
[8]   Thermal, mechanical and electrical properties of Pd-based thin-film metallic glass [J].
Liu, YD ;
Hata, S ;
Wada, K ;
Shimokohbe, A .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2001, 40 (9A) :5382-5388
[9]  
Payne R. S., 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308), P7, DOI 10.1109/MEMSYS.2000.838481
[10]   Effect of specimen size on Young's modulus and fracture strength of polysilicon [J].
Sharpe, WN ;
Jackson, KM ;
Hemker, KJ ;
Xie, ZL .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2001, 10 (03) :317-326