Modeling of the ion mass effect on transient enhanced diffusion: Deviation from the "+1" model

被引:54
作者
Pelaz, L
Gilmer, GH
Jaraiz, M
Herner, SB
Gossmann, HJ
Eaglesham, DJ
Hobler, G
Rafferty, CS
Barbolla, J
机构
[1] AT&T Bell Labs, Lucent Technol, Murray Hill, NJ 07974 USA
[2] Univ Valladolid, E-47011 Valladolid, Spain
[3] Univ Valladolid, E-47071 Valladolid, Spain
[4] Univ Technol Vienna, A-1040 Vienna, Austria
关键词
D O I
10.1063/1.121963
中图分类号
O59 [应用物理学];
学科分类号
摘要
The influence of ion mass on transient enhanced diffusion (TED) and defect evolution after ion implantation in Si has been studied by atomistic simulation and compared with experiments. We have analyzed the TED induced by B, P, and As implants with equal range and energy: TED increases with ion mass for equal range implants, and species of different mass but equal energy cause approximately the same amount of TED. Heavier ions produce a larger redistribution of the Si atoms in the crystal, leading to a larger excess of interstitials deeper in the bulk and an excess of vacancies closer to the surface. For high-mass ions more interstitials escape recombination with vacancies, are stored in clusters, and then contribute to TED. TED can be described in terms of an effective "+n" or "plus factor" that increases with the implanted ion mass. (C) 1998 American Institute of Physics. [S0003-6951(98)01836-1].
引用
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页码:1421 / 1423
页数:3
相关论文
共 13 条
[1]   Reduction of transient diffusion from 1-5 keV Si+ ion implantation due to surface annihilation of interstitials [J].
Agarwal, A ;
Gossmann, HJ ;
Eaglesham, DJ ;
Pelaz, L ;
Jacobson, DC ;
Haynes, TE ;
Erokhin, YE .
APPLIED PHYSICS LETTERS, 1997, 71 (21) :3141-3143
[2]   Species and dose dependence of ion implantation damage induced transient enhanced diffusion [J].
Chao, HS ;
Crowder, SW ;
Griffin, PB ;
Plummer, JD .
JOURNAL OF APPLIED PHYSICS, 1996, 79 (05) :2352-2363
[3]   IMPLANTATION AND TRANSIENT B-DIFFUSION IN SI - THE SOURCE OF THE INTERSTITIALS [J].
EAGLESHAM, DJ ;
STOLK, PA ;
GOSSMANN, HJ ;
POATE, JM .
APPLIED PHYSICS LETTERS, 1994, 65 (18) :2305-2307
[4]   POINT-DEFECTS AND DOPANT DIFFUSION IN SILICON [J].
FAHEY, PM ;
GRIFFIN, PB ;
PLUMMER, JD .
REVIEWS OF MODERN PHYSICS, 1989, 61 (02) :289-384
[5]   Modeling silicon implantation damage and transient enhanced diffusion effects for silicon technology development [J].
Giles, MD ;
Yu, SF ;
Kennel, HW ;
Packan, PA .
DEFECTS AND DIFFUSION IN SILICON PROCESSING, 1997, 469 :253-264
[6]   TRANSIENT PHOSPHORUS DIFFUSION BELOW THE AMORPHIZATION THRESHOLD [J].
GILES, MD .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1991, 138 (04) :1160-1165
[7]  
Griffin P. B., 1993, International Electron Devices Meeting 1993. Technical Digest (Cat. No.93CH3361-3), P295, DOI 10.1109/IEDM.1993.347349
[8]   Ion mass influence on transient enhanced diffusion and boron clustering in silicon: Deviation from the "+1" model [J].
Herner, SB ;
Gossmann, HJ ;
Pelaz, LP ;
Gilmer, GH ;
Jaraiz, M ;
Jacobson, DC ;
Eaglesham, DJ .
JOURNAL OF APPLIED PHYSICS, 1998, 83 (11) :6182-6184
[9]  
Hobler G, 1996, ELEC SOC S, V96, P509
[10]  
Jaraiz M, 1996, APPL PHYS LETT, V68, P409, DOI 10.1063/1.116701