A novel manufacturing process for capacitors using offset lithography

被引：14

作者：

Harrey, PM ^{[1
]}

Evans, PSA ^{[1
]}

Ramsey, BJ ^{[1
]}

Harrison, D ^{[1
]}

机构：

[1] Brunel Univ, Dept Design, Egham TW20 0JZ, Surrey, England

来源：

FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS | 1999年

关键词：

film circuits; dielectric inks; conductive inks; capacitors; printing; circuit boards; offset lithography; printed films;

D O I：

10.1109/ECODIM.1999.747726

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

A novel fabrication technique for passive electronic components and circuit interconnects based on offset lithographic printing is described. The application of this work is in low cost and low, environmental impact substitutes for resin-laminate circuit boards populated with discrete components. Multilayer ceramic capacitor elements are formed on flexible substrates by depositing layers of metal and ceramic-loaded inks sequentially via a standard lithographic printing press.

引用

页码：842 / 846

页数：5