EDA in IBM: Past, present, and future

被引：35

作者：

Darringer, J ^{[1
]}

Davidson, E ^{[1
]}

Hathaway, DJ ^{[1
]}

Koenemann, B ^{[1
]}

Lavin, M ^{[1
]}

Morrell, JK ^{[1
]}

Rahmat, K ^{[1
]}

Roesner, W ^{[1
]}

Schanzenbach, E ^{[1
]}

Tellez, G ^{[1
]}

Trevillyan, L ^{[1
]}

机构：

[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA

来源：

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 2000年 / 19卷 / 12期

关键词：

D O I：

10.1109/43.898827

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Throughout its history, from the early four-circuit gate-array chips of the late 1960s to today's billion-transistor multichip module, IBM has invested in tools to support its leading-edge technology and high-performance product development. The combination of demanding designs and close cooperation among product, technology, and tool development has given rise to many innovations in the electronic design automation (EDA) area and provided IBM with a significant competitive advantage. This paper highlights IBM's contributions over the last four decades and presents a view of the future, where the best methods of multimillion gate ASIC and gigahertz microprocessor design are converged to enable highly productive system-on-a-chip designs that include widely diverse hardware and software components.

引用

页码：1476 / 1497

页数：22

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