Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold

被引：62

作者：

Nordström, M

Johansson, A

Noguerón, ES

Clausen, B

Calleja, M

Boisen, A

机构：

[1] Tech Univ Denmark, Dept Micro & Nanotechnol, MIC, DK-2800 Lyngby, Denmark

[2] Tech Univ Denmark, Dept Mfg Engn & Management, IPL, DK-2800 Lyngby, Denmark

[3] CSIC, Ctr Nacl Microelect, Biosensors Grp, E-28760 Madrid, Spain

来源：

MICROELECTRONIC ENGINEERING | 2005年 / 78-79卷

关键词：

SU-8; adhesion; metal; pull-test experiments;

D O I：

10.1016/j.mee.2004.12.021

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and An. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either An or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and An without any adhesion promoter we find a bond strength of 4.8 +/- 1.2 MPa for a 7.5-mu m-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8. (c) 2004 Elsevier B.V. All rights reserved.

引用

页码：152 / 157

页数：6

共 9 条

[1] Polymeric cantilever arrays for biosensing applications [J].