A reexamination of residual stresses in thin films and of the validity of Stoney's estimate

被引：13

作者：

Hui, CY ^{[1
]}

Conway, HD ^{[1
]}

Lin, YY ^{[1
]}

机构：

[1] Cornell Univ, Dept Theoret & Appl Mech, Ithaca, NY 14853 USA

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2000年 / 122卷 / 03期

关键词：

D O I：

10.1115/1.1287930

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The residual stresses in thin films are explained using elementary mechanics. In particular, the range of validity of the well-known Stoney's formula is examined using a strength of materials approach. An improved formula is obtained. The results of these analyses can also be used to compute energy release rates of cracks in thin film systems. Some simple examples of such applications are given. [S1043-7398(00)01603-0].

引用

页码：267 / 273

页数：7

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