Micromechanical testing of MEMS materials

被引:21
作者
Buchheit, TE
Glass, SJ
Sullivan, JR
Mani, SS
Lavan, DA
Friedmann, TA
Janek, R
机构
[1] Sandia Natl Labs, Albuquerque, NM 87185 USA
[2] MIT, Cambridge, MA 02139 USA
[3] Sandia Natl Labs, Livermore, CA 94550 USA
关键词
PMMA; Silicon Wafer; Polysilicon; Multilayer Film; Tensile Test Result;
D O I
10.1023/A:1026365219307
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper discusses tensile testing techniques and results derived as part of a broader microstructure-properties investigation of structural materials used in surface micromachined (SMM), and LIGA MEMS technologies. SMM techniques produce devices on the surface of a silicon wafer, with critical dimensions as small as 1-2 mum, using a subtractive multilayer film deposition process. Two structural materials have been investigated: SUMMiT(TM) polysilicon and amorphous Diamond (a-D). Mechanical properties presented in this paper on these SMM structural materials were obtained from a direct tensile testing method using the lateral force measurement capability of a nanoindentation system. LIGA, a German acronym extracted from the words "Lithographie, Galvanoformung, Abformung," is an additive process in which structural material is electrodeposited into a polymethyl-methacrylate ( PMMA) molds realized by deep x-ray lithography. LIGA tensile specimens of several different materials have been evaluated using a mini-servohydraulic load frame, designed to test specimens of sizes similar to structural components. In this paper, tensile test results from LIGA fabricated Ni and Ni-alloys and examples of their correlation to processing and microstructure will be presented. (C) 2003 Kluwer Academic Publishers.
引用
收藏
页码:4081 / 4086
页数:6
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