Electrical resistivity of copper-silica nanocomposites synthesized by electrodeposition

被引：11

作者：

Banerjee, S ^{[1
]}

Chakravorty, D

机构：

[1] Indian Assoc Cultivat Sci, Kolkata 700032, W Bengal, India

[2] Jawaharlal Nehru Ctr Adv Sci Res, Bangalore 560064, Karnataka, India

来源：

JOURNAL OF APPLIED PHYSICS | 1998年 / 84卷 / 02期

关键词：

D O I：

10.1063/1.368116

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Composites containing copper particles with nanometer dimensions in a silica gel medium have been Synthesized by an electrodeposition technique. The precursor composition of the gel was in the system Cu(NO3)(2)-SiO2 and the copper particle diameters were in the range of 3.2-11.4 nm. The de electrical resistivity of pellets obtained from the nanocomposite powders was measured in the temperature range of 110-300 K. A temperature dependence with a fractional exponent of 0.25 was observed. This behavior has been explained on the basis of a variable range hopping mechanism. (C) 1998 American Institute of Physics. [S0021-8979(98)01614-4].

引用

页码：1149 / 1151

页数：3

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