Economic efficiency analysis of wafer fabrication

被引:54
作者
Leachman, Robert C. [1 ]
Ding, Shengwei
Chien, Chen-Fu
机构
[1] Univ Calif Berkeley, Dept Ind Engn & Operat Res, Berkeley, CA 94720 USA
[2] Natl Tsing Hua Univ, Dept Ind Engn & Engn Management, Hsinchu 30013, Taiwan
关键词
data envelopment analysis (DEA); economies of scale; fab economics; relative efficiency; semiconductor manufacturing;
D O I
10.1109/TASE.2007.906142
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Economic efficiency analysis of semiconductor fabrication 'facilities (fabs) involves tradeoffs among cost, yield, and cycle time. Due to the disparate units involved, direct evaluation and comparison is difficult. This article employs data envelopment analysis (DEA) to determine relative efficiencies among fabs over time on the basis of empirical data, whereby cycle time performance is, transformed into monetary value according to an estimated price decline rate. Two alternative DEA models are formulated to evaluate the influence of cycle time and other performance attributes. The results show that cycle time and yield follow increasing returns to scale, just as do cost and resource utilization. Statistical analyses are performed to investigate the DEA results, leading to specific improvement directions and opportunities for relatively inefficient fabs.
引用
收藏
页码:501 / 512
页数:12
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