Measurement of micromechanical properties of polysilicon microstructures with an atomic force microscope

被引：35

作者：

Serre, C

Gorostiza, P

Perez-Rodriguez, A

Sanz, F

Morante, JR

机构：

[1] Univ Barcelona, EME, Dept Elect, E-08028 Barcelona, Spain

[2] Univ Barcelona, Dept Quim Fis, E-08028 Barcelona, Spain

[3] Univ Barcelona, Serv Cientificotecn, E-08028 Barcelona, Spain

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1998年 / 67卷 / 1-3期

关键词：

mechanical properties; micromechanical devices; thin films; polysilicon; atomic force microscopes; Young's modulus;

D O I：

10.1016/S0924-4247(98)00031-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel, straightforward and convenient method for measurement of micromechanical properties by beam bending using an atomic force microscope in contact mode is presented. This method combines a very high load resolution with a nanometric precision in the determination of the cantilever deflection, thus allowing accurate measurements to be made. First results applied to the determination of the Young's modulus of polysilicon cantilever beams are presented. (C) 1998 Elsevier Science S.A. All rights reserved.

引用

收藏

页码：215 / 219

页数：5

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