INTEGRATED MOVABLE MICROMECHANICAL STRUCTURES FOR SENSORS AND ACTUATORS

被引:168
作者
FAN, LS [1 ]
TAI, YC [1 ]
MULLER, RS [1 ]
机构
[1] UNIV CALIF BERKELEY,ELECTR RES LAB,BERKELEY,CA 94720
关键词
ACTUATORS - FINAL CONTROL DEVICES - SENSORS;
D O I
10.1109/16.2523
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Movable pin-joints, gears, springs, cranks, and slider structures with dimensions measured in micrometers have been fabricated using silicon microfabrication technology. These micromechanical structures, which have important transducer applications, are batch-fabricated with an IC-compatible process. The movable mechanical elements are built on layers that are later removed so that they are freed for translation and rotation. An undercut-and-refill technique which makes use of the high surface mobility of silicon atoms undergoing chemical vapor deposition, is used to refill undercut regions in order to form restraining flanges. Typical element sizes and masses are measured in micro meters and nano grams. The process provides the tiny structures in an assembled form avoiding the nearly impossible challenge of handling such small elements individually.
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页码:724 / 730
页数:7
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