Surface micromachined accelerometers

被引:195
作者
Boser, BE
Howe, RT
机构
[1] Elec. Eng. and Comp. Sci. Department, University of California Berkeley, Berkeley
[2] Swiss Fed. Institute of Technology, Zurich
[3] Stanford University, Stanford, CA
[4] Dept. of Elec. Eng. and Comp. Sci., University of California, Berkeley, CA
[5] Harvey Mudd College, Claremont, CA
[6] University of California, Berkeley, CA
[7] IEEE Micro Electro Mech. Syst. W., Solid-State Sensor Actuator W., Hilton Head, SC
关键词
D O I
10.1109/4.494198
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Surface micromachining has enabled the cofabrication of thin-film micromechanical structures and CMOS or Bipolar/MOS integrated circuits, Using linear, single-axis accelerometers as a motivating example, this paper discusses the fundamental mechanical as well as the electronic noise floors for representative capacitive position-sensing interface circuits, Operation in vacuum lowers the Brownian noise of a polysilicon accelerometer to below 1 mu g/root Hz. For improved sensor performance, the position of the microstructure should be controlled using electrostatic force-feedback. Both analog and digital closed-loop accelerometers are described and contrasted, with the latter using high-frequency voltage pulses to apply force quanta to the microstructure and achieve a very linear response.
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收藏
页码:366 / 375
页数:10
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