Surface micromachined accelerometers

被引：195

作者：

Boser, BE

Howe, RT

机构：

[1] Elec. Eng. and Comp. Sci. Department, University of California Berkeley, Berkeley

[2] Swiss Fed. Institute of Technology, Zurich

[3] Stanford University, Stanford, CA

[4] Dept. of Elec. Eng. and Comp. Sci., University of California, Berkeley, CA

[5] Harvey Mudd College, Claremont, CA

[6] University of California, Berkeley, CA

[7] IEEE Micro Electro Mech. Syst. W., Solid-State Sensor Actuator W., Hilton Head, SC

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1996年 / 31卷 / 03期

关键词：

D O I：

10.1109/4.494198

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Surface micromachining has enabled the cofabrication of thin-film micromechanical structures and CMOS or Bipolar/MOS integrated circuits, Using linear, single-axis accelerometers as a motivating example, this paper discusses the fundamental mechanical as well as the electronic noise floors for representative capacitive position-sensing interface circuits, Operation in vacuum lowers the Brownian noise of a polysilicon accelerometer to below 1 mu g/root Hz. For improved sensor performance, the position of the microstructure should be controlled using electrostatic force-feedback. Both analog and digital closed-loop accelerometers are described and contrasted, with the latter using high-frequency voltage pulses to apply force quanta to the microstructure and achieve a very linear response.

引用

页码：366 / 375

页数：10

共 35 条

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