Electrical modeling and simulation challenges in chip-package codesign

被引：11

作者：

Cangellaris, AC ^{[1
]}

机构：

[1] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA

来源：

IEEE MICRO | 1998年 / 18卷 / 04期

关键词：

D O I：

10.1109/40.710871

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

High-performance, multifunctional systems demand novel, often revolutionary, practices in functional-block integration and packaging. Independent chip, package, and board design will have to give way to a holistic approach.

引用

页码：50 / 59

页数：10

共 11 条

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