A CFD analysis of an electronics cooling enclosure for application in telecommunication systems

被引：32

作者：

Boukhanouf, R. ^{[1
]}

Haddad, A. ^{[2
]}

机构：

[1] Univ Nottingham, Sch Built Environm, Nottingham NG7 2RD, England

[2] Nuventix Inc, D-80337 Munich, Germany

来源：

APPLIED THERMAL ENGINEERING | 2010年 / 30卷 / 16期

基金：

英国工程与自然科学研究理事会;

关键词：

Electronics cooling; CFD; Flotherm; RF components; Heat spreader; HEAT-PIPE; LIMITS;

D O I：

10.1016/j.applthermaleng.2010.06.012

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper presents results of CFD analysis of an electronics cooling enclosure used as part of a larger telecommunication radar system. An original cooling enclosure was simulated using Flotherm which results were taken as the benchmark thermal performance. It was found that the operating temperature of one of the Radio Frequency (RF) components will exceed the design temperature limit of the PCB. A solution involving a re-design of thermal spreading arrangements using a 3 mm thick copper shelf and a Vapour Chamber (VC) heat pipe was found to bring the operating temperatures of all RF components within the specified temperature limits. The use of a VC, in particular, reduced the 60 W RF component steady state temperature by an average of 5.4 degrees C. The study also shows that increasing the finned heat exchanger cooling air flow rate can lower further the RF components temperature though at the expense of increasing energy consumption of the fan. (C) 2010 Elsevier Ltd. All rights reserved.

引用

页码：2426 / 2434

页数：9

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