The pervasiveness of automotive passive restraint systems has emphasized the need for improving system reliability while simultaneously reducing the cost and size of the system. This paper describes the integrated silicon automotive accelerometer (ISAAC), which consists of a silicon micromachined die fabricated in a dissolved-wafer process and a CMOS ASIC that are combined in a standard plastic package. The resultant device meets the functional, cost, and reliability requirements of the next generation of automotive passive restraint systems.