Microstructure of solder joints with electronic components in lead-free solders

被引：31

作者：

Nakamura, Y ^{[1
]}

Sakakibara, Y ^{[1
]}

Watanabe, Y ^{[1
]}

Amamoto, Y ^{[1
]}

机构：

[1] Natl Def Acad, Dept Mat Sci & Engn, Yokosuka, Kanagawa 239, Japan

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 1998年 / 10卷 / 01期

关键词：

lead-free soldering; microstructure; solder joint;

D O I：

10.1108/09540919810203748

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The microstructure of the Sn-3.5wt%/Ag/Cu and Sn-9.0wt%Zn/Cu interfaces after soldering at 250 degrees C was evaluated, The cross-sections were investigated using a scanning electron microscope and energy dispersive X-ray to determine the interface layer structure and composition. Even though the cooling rate from soldering temperature to room temperature is rapid, this study indicates that the intermetallic compound is formed at the interface between the solder and the copper substrate for both the Sn-3.5wt%Ag and the Sn-9.0wt%Zn lead-free solders.

引用

页码：10 / +

页数：4

共 11 条

[1]

Anderko K., 1958, CONSTITUTION BINARY, P649

[2] LOW-TEMPERATURE COMPOUND FORMATION IN CU/SN THIN-FILM COUPLES [J].

CHOPRA, R ;

OHRING, M ;

OSWALD, RS .

THIN SOLID FILMS, 1982, 94 (04) :279-288

[3]

HALIMI R, 1987, THIN SOLID FILMS, V108, P109

[4]

KATTNER UR, 1994, J ELECT MAT, V23, P619

[5] NEW LEAD-FREE, SN-ZN-IN SOLDER ALLOYS [J].

MCCORMACK, M ;

JIN, S ;

CHEN, HS ;

MACHUSAK, DA .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :687-690

[6]

MCCORMACK M, 1993, APPL PHYS LETT, V93, P16

[7]

MCCORMACK M, 1993, J MET, V45, P33

[8]

MUMAR K, 1981, J ELECT CHEM, V128, P379

[9] Microstructure and strength of interface between Sn-Ag eutectic solder and Cu [J].

Suganuma, K ;

Nakamura, Y .

JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1995, 59 (12) :1299-1305

[10]

WEISS M, 1981, INT J CLIN PHARM TH, V19, P379

← 1 2 →