Backside laserprober characterization of thermal effects during high current stress in Smart Power ESD protection devices

被引：5

作者：

Fürböck, C ^{[1
]}

Seliger, N ^{[1
]}

Pogany, D ^{[1
]}

Litzenberger, M ^{[1
]}

Gornik, E ^{[1
]}

Stecher, M ^{[1
]}

Gossner, H ^{[1
]}

Werner, W ^{[1
]}

机构：

[1] Vienna Univ Technol, Inst Solid State Elect, A-1040 Vienna, Austria

来源：

INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST | 1998年

关键词：

D O I：

10.1109/IEDM.1998.746451

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present a study of thermal effects in Smart Power Electrostatic Discharge (ESD) protection structures by application of a noninvasive infrared backside laserprober technique. The temperature increase in the device active area is obtained from the time resolved measurements of optical phase changes under ESD-like high current stress. Results of temperature distribution and thermal dynamics for different device operation modes are presented.

引用

页码：691 / 694

页数：4

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