Atomistic study of interaction zone at copper-carbon interfaces

被引：58

作者：

Dorfman, S ^{[1
]}

Mundim, KC

Fuks, D

Berner, A

Ellis, DE

Van Humbeeck, J

机构：

[1] Technion Israel Inst Technol, Fac Phys, IL-32000 Haifa, Israel

[2] Katholieke Univ Leuven, Dept Mat Engn, Louvain, Belgium

[3] Univ Brasilia, Inst Quim, BR-70919970 Brasilia, DF, Brazil

[4] Ben Gurion Univ Negev, Dept Mat Engn, IL-84105 Beer Sheva, Israel

[5] Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel

[6] Northwestern Univ, Dept Phys & Astron, Evanston, IL 60208 USA

来源：

MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS | 2001年 / 15卷 / 1-2期

关键词：

composite; interatomic potentials; Cu; C; solid solutions;

D O I：

10.1016/S0928-4931(01)00308-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Formation of Cu-C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu-C composite leads to the formation of thin (approximately 50 nm) interface, which provides the bonding between fiber and matrix, The high-resolution scanning electron microscopy (HR SEM) study displays the formation of the interaction zone. Monte Carlo simulations with repulsive Cu-C interatomic potentials study this zone on the interface. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：191 / 193

页数：3

共 10 条

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