Flow behaviour of thin polymer films used for hot embossing lithography

被引：300

作者：

Heyderman, LJ ^{[1
]}

Schift, H

David, C

Gobrecht, J

Schweizer, T

机构：

[1] Paul Scherrer Inst, Lab Micro & Nanotechnol, CH-5232 Villigen, Switzerland

[2] Swiss Fed Inst Technol, Inst Polymers, ETH, CH-8092 Zurich, Switzerland

来源：

MICROELECTRONIC ENGINEERING | 2000年 / 54卷 / 3-4期

关键词：

hot embossing; nano imprint lithography; polymer moulding; microstructures; nanostructures;

D O I：

10.1016/S0167-9317(00)00414-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The viscous flow of thin PMMA films into microcavities during hot embossing has been investigated in order to optimise the moulding process for nanostructured surfaces. The fastest embossing times were obtained at temperatures > 100 degreesC above T-g with viscosities in the range 300 to 3000 Pa s. Two fill mechanisms have been observed: simple how of the PMMA from the borders and formation of polymer mounds. A simple theory was used to estimate the embossing time required to fill a given stamp geometry. Thin polymer ridges with aspect ratios up to 6:1 were moulded and plastic deformation during demoulding was observed. (C) 2000 Elsevier Science B.V. All rights reserved.

引用

页码：229 / 245

页数：17

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