Microscale materials testing using MEMS actuators

被引:94
作者
Haque, MA [1 ]
Saif, MTA [1 ]
机构
[1] Univ Illinois, Dept Mech & Ind Engn, Urbana, IL 61801 USA
基金
美国国家科学基金会;
关键词
bending test; MEMS; tensile testing; thin films;
D O I
10.1109/84.911103
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Small size scale and high resolutions in force and displacement measurements make MEMS actuators appropriate for micromechanical testing, in this paper, for the first time, we present methodologies for uniaxial tensile and cantilever bending testing of both micrometer- and submicrometer-scale freestanding specimens using MEMS actuators. We also introduce dry fabrication processes for the specimens. The methodologies allo tv freestanding single or multilayered thin-film specimens to be fabricated separately from the MEMS actuators. For the uniaxial tension test, tensile forces are applied by lateral comb drive actuators capable of generating a total load of 383 muN at 40 V with resolutions on the order of 3 nN. A similar actuator is used in the bending test, with load resolution of 58 nN and spring constant of 0.78 N/m. The tensile testing methodology is demonstrated with the testing of a 110-nm-thick freestanding aluminum specimen. The cantilever bending experiment is performed on a 100-nm-thick aluminum specimen. The experimental setups can be mounted in a SEM land also in a TEM after modifications for tensile testing) for in situ observation of materials behavior under different environmental conditions. Remarkable strengthening is observed in all the specimens tested compared to their bulk counterparts in both tensile and bending experiments. Experimental results highlight the potential of MEMS actuators as a ne rv tool for materials research.
引用
收藏
页码:146 / 152
页数:7
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