Microvia filling of a printed circuit board was achieved using an accelerator-free acid copper plating solution. The required accelerator (i. e., bis(3-sulfopropyl) disulfide, SPS) for the filling procedure was adsorbed on seed layers in advance. Two metallic materials, copper and gold, were employed as the seed layers. The SPS adlayer is demonstrated to be persistently transferable from the seed layer onto the surface of as-deposited copper layer during electrodeposition. The SPS adlayer induced copper superfill of the microvia. Three kinds of microstructures of the copper deposit were observed due to the depletion of the SPS adlayer. (c) 2005 The Electrochemical Society.
机构:
Seoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South KoreaSeoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South Korea
Cho, SK
;
Kim, SK
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Seoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South KoreaSeoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South Korea
Kim, SK
;
Kim, JJ
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Seoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South KoreaSeoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South Korea
机构:
Seoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South KoreaSeoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South Korea
Cho, SK
;
Kim, SK
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h-index: 0
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Seoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South KoreaSeoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South Korea
Kim, SK
;
Kim, JJ
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h-index: 0
机构:
Seoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South KoreaSeoul Natl Univ, Sch Chem Engn, Res Ctr Energy Convers & Storage, Seoul 151742, South Korea