Microvia filling over self-assembly disulfide molecule on Au and Cu seed layers - A morphological study of copper deposits

被引：32

作者：

Dow, WP ^{[1
]}

Yen, MY ^{[1
]}

机构：

[1] Natl Yunlin Univ Sci & Technol, Dept Chem Engn, Touliu 640, Yunlin, Taiwan

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 2005年 / 8卷 / 11期

关键词：

D O I：

10.1149/1.2039957

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Microvia filling of a printed circuit board was achieved using an accelerator-free acid copper plating solution. The required accelerator (i. e., bis(3-sulfopropyl) disulfide, SPS) for the filling procedure was adsorbed on seed layers in advance. Two metallic materials, copper and gold, were employed as the seed layers. The SPS adlayer is demonstrated to be persistently transferable from the seed layer onto the surface of as-deposited copper layer during electrodeposition. The SPS adlayer induced copper superfill of the microvia. Three kinds of microstructures of the copper deposit were observed due to the depletion of the SPS adlayer. (c) 2005 The Electrochemical Society.

引用

页码：C161 / C165

页数：5

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