Superconformal electrodeposition of copper

被引:297
作者
Moffat, TP [1 ]
Wheeler, D
Huber, WH
Josell, D
机构
[1] Natl Inst Stand & Technol, Mat Sci & Engn Lab, Gaithersburg, MD 20899 USA
[2] Natl Inst Stand & Technol, Elect & Elect Engn Lab, Gaithersburg, MD 20899 USA
关键词
D O I
10.1149/1.1354496
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
A model of superconformal electrodeposition is presented based on a local growth velocity that is proportional to coverage of a catalytic species at the metal/electrolyte interface. The catalyst accumulates at the interface through reaction with the electrolyte. More importantly, if the concentration of the catalyst precursor in the electrolyte is dilute, then surface coverage within small features can change far more rapidly due to changing interface area. In such a case, the catalyst effectively floats on the interface during deposition, with changes in coverage coupled to alterations in arc-length of the moving surface. The local coverage therefore increases during conformal growth on a concave surface, resulting in a corresponding increase in the local deposition rate. The opposite is true for a convex surface. The model is supported by experiments and simulations of superconformal copper deposition in 350-100 nm wide features. The model also has significant implications for understanding the influence of adsorbates on the evolution of surface roughness during electrodeposition. (C) 2001 The Electrochemical Society.
引用
收藏
页码:C26 / C29
页数:4
相关论文
共 14 条
[1]   Damascene copper electroplating for chip interconnections [J].
Andricacos, PC ;
Uzoh, C ;
Dukovic, JO ;
Horkans, J ;
Deligianni, H .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1998, 42 (05) :567-574
[2]  
BARD AJ, 1980, ELECTROCHEMICAL METH
[3]   Self-assembly of n-alkanethiols:: A kinetic study by second harmonic generation [J].
Dannenberger, O ;
Buck, M ;
Grunze, M .
JOURNAL OF PHYSICAL CHEMISTRY B, 1999, 103 (12) :2202-2213
[4]  
Deligianni H, 1999, ELEC SOC S, V99, P52
[5]   Sticking probabilities in adsorption from liquid solutions: Alkylthiols on gold [J].
Jung, LS ;
Campbell, CT .
PHYSICAL REVIEW LETTERS, 2000, 84 (22) :5164-5167
[6]   Impedance investigation of the mechanism of copper electrodeposition from acidic perchlorate electrolyte [J].
Krzewska, S .
ELECTROCHIMICA ACTA, 1997, 42 (23-24) :3531-3540
[7]   Superconformal electrodeposition of copper in 500-90 nm features [J].
Moffat, TP ;
Bonevich, JE ;
Huber, WH ;
Stanishevsky, A ;
Kelly, DR ;
Stafford, GR ;
Josell, D .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (12) :4524-4535
[8]  
Reid J., 2000, Advanced Metallization Conference 1999 (AMC 1999). Proceedings of the Conference, P53
[9]  
Richard E., 2000, Advanced Metallization Conference 1999 (AMC 1999). Proceedings of the Conference, P149
[10]  
Ritzdorf T., 2000, Advanced Metallization Conference 1999 (AMC 1999). Proceedings of the Conference, P101