Inhibition due to the interaction of polyethylene glycol, chloride, and copper in plating baths: A surface-enhanced Raman study

被引:252
作者
Feng, ZV
Li, X
Gewirth, AA
机构
[1] Univ Illinois, Dept Chem, Urbana, IL 61801 USA
[2] Univ Illinois, Fredrick Seitz Mat Res Lab, Urbana, IL 61801 USA
关键词
D O I
10.1021/jp034875m
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The synergic effect of poly(ethylene glycol) together with chloride ion for inhibiting copper deposition in copper electroplating has been of particular interest for some time. In this study, the potential-dependent behavior of poly(ethylene glycol), with or without chloride ion in a copper electroplating bath is investigated using the surface-enhanced Raman spectroscopy technique. The presence of chloride proves to play a significant role in enhancing PEG adsorption to the Cu electrode surface. More importantly, spectroscopic evidence strongly suggests the formation of a PEG-Cu-Cl complex. By comparing experiment with vibrational modes calculated by using the Hartree-Fock method with a 3-21G* basis set, the structure of this complex is proposed to be a three-coordinated Cu center with two oxygen atoms from PEG and one chloride ligand.
引用
收藏
页码:9415 / 9423
页数:9
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