On the contributions of the electronic polarizability and porosity to the reduction of the refractive index of SiOF films deposited by remote plasma-enhanced chemical vapor deposition

被引:8
作者
Alonso, JC
Díaz-Bucio, XM
Pichardo, E
Rodríguez-Fernández, L
Ortiz, A
机构
[1] Univ Nacl Autonoma Mexico, Inst Fis, Mexico City 04510, DF, Mexico
[2] Univ Nacl Autonoma Mexico, Inst Invest Mat, Mexico City 04510, DF, Mexico
关键词
fluorinated silicon oxide; plasma processing and deposition; optical properties; ellipsometry;
D O I
10.1016/j.tsf.2004.08.078
中图分类号
T [工业技术];
学科分类号
08 [工学];
摘要
The behavior of refractive index as a function of fluorine content of SiOF films deposited by remote plasma-enhanced chemical vapor deposition (RPECVD) from SiF4/H-2/O-2/Ar mixtures was studied. The refractive index and fluorine content of the films was evaluated by ellipsometry, infrared spectroscopy and resonant nuclear reactions (RNRs). The contributions of the electronic polarizability and porosity to the experimentally found reduction of the refractive index of the films, as a function of fluorine content, were calculated using the Clausius-Mossotti relation and the Maxwell-Gamett equation of the effective medium theory, in combination with a pseudo-binary alloy representation [(SiO2)(x)(Si2O3F2)(1-x)] proposed recently for the SiOF system. We found that the reduction in the electronic polarizability of this alloy due to the incorporation of fluorine has a minimal contribution to the reduction of the refractive index of the SiOF films. Therefore, the main mechanism responsible for this reduction is the porosity generated in the films as fluorine is incorporated in its network. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:294 / 300
页数:7
相关论文
共 34 条
[1]
Effect of hydrogen dilution on the structure of SiOF films prepared by remote plasma enhanced chemical vapor deposition from SiF4-based plasmas [J].
Alonso, JC ;
Pichardo, E ;
Pankov, V ;
Ortiz, A .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2000, 18 (06) :2827-2834
[2]
Fluorinated-chlorinated SiO2 films prepared at low temperature by remote plasma-enhanced chemical-vapor deposition using mixtures of SiF4 and SiCl4 [J].
Alonso, JC ;
Pichardo, E ;
Rodríguez-Fernandez, L ;
Cheang-Wong, JC ;
Ortiz, A .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2001, 19 (02) :507-514
[3]
[Anonymous], 1992, INTERMOLECULAR SURFA
[4]
OPTICAL-PROPERTIES OF THIN-FILMS [J].
ASPNES, DE .
THIN SOLID FILMS, 1982, 89 (03) :249-262
[5]
ATKINS PW, 1997, MOL QUANTUM MECH, pCH12
[6]
Deposition of stable, low κ and high deposition rate SiF4-doped TEOS fluorinated silicon dioxide (SiOF) films [J].
Bhan, MK ;
Huang, J ;
Cheung, D .
THIN SOLID FILMS, 1997, 308 :507-511
[7]
Infrared ellipsometric study of SiO2 films:: relationship between LO mode frequency and porosity [J].
Brunet-Bruneau, A ;
Fisson, S ;
Gallas, B ;
Vuye, G ;
Rivory, J .
THIN SOLID FILMS, 2000, 377 :57-61
[8]
Burns G., 1985, Solid State Physics
[9]
Dielectric functions of Si nanocrystals embedded in a SiO2 matrix -: art. no. 153301 [J].
Chen, TP ;
Liu, Y ;
Tse, MS ;
Tan, OK ;
Ho, PF ;
Liu, KY ;
Gui, D ;
Tan, ALK .
PHYSICAL REVIEW B, 2003, 68 (15)
[10]
Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide [J].
Cheng, YL ;
Wang, YL ;
Chen, HW ;
Lan, JL ;
Liu, CP ;
Wu, SA ;
Wu, YL ;
Lo, KY ;
Feng, MS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2004, 22 (03) :494-499