Edge effect during nanoindentation of thin copper films

被引：23

作者：

Soifer, YM

Verdyan, A

Kazakevich, M

Rabkin, E ^{[1
]}

机构：

[1] Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel

[2] Holon Acad Inst Technol, Dept Sci, IL-58102 Holon, Israel

来源：

MATERIALS LETTERS | 2005年 / 59卷 / 11期

基金：

以色列科学基金会;

关键词：

atomic force microscopy; thin films; mechanical properties; nanoindentation;

D O I：

10.1016/j.matlet.2004.08.043

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We used nanoindenting atomic force microscopy (AFM) for studying mechanical properties of the polycrystalline copper film deposited on Si substrates and patterned into 4-8 mu m wide lines. The dependence of mechanical properties of the line on a distance from the line edge was studied. It was shown that the indentation compliance of the line increases with decreasing distance between the indent center and the edge of the strip. An unusual plastic deformation behavior of the lines in the edge region was observed. (c) 2005 Elsevier B.V. All rights reserved.

引用

页码：1434 / 1438

页数：5

共 8 条

[1]

[Anonymous], 1967, THEORY DISLOCATIONS

[2] Non-linear deformation mechanisms during nanoindentation [J].