Nanoindentation of patterned metal lines on a Si substrate

被引：30

作者：

Choi, Y ^{[1
]}

Suresh, S ^{[1
]}

机构：

[1] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA

来源：

SCRIPTA MATERIALIA | 2003年 / 48卷 / 03期

关键词：

nanoindentation; mechanical properties; plastic deformation; thin films; patterned lines;

D O I：

10.1016/S1359-6462(02)00377-9

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A systematic experimental study of nanoindentation on unidirectionally patterned aluminum lines on a Si substrate has been conducted. The results show that the observed increase in indentation compliance with decreasing line width cannot be rationalized on the basis of continuum considerations. A simple mechanistic model based on discrete dislocations is suggested. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.

引用

页码：249 / 254

页数：6

共 10 条

[1] Non-linear deformation mechanisms during nanoindentation [J].