Influence of molecular weight of polyethylene glycol on microvia filling by copper electroplating

被引：209

作者：

Dow, WP ^{[1
]}

Yen, MY ^{[1
]}

Lin, WB ^{[1
]}

Ho, SW ^{[1
]}

机构：

[1] Natl Yunlin Univ Sci & Technol, Dept Chem Engn, Touliu 640, Yunlin, Taiwan

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2005年 / 152卷 / 11期

关键词：

D O I：

10.1149/1.2052019

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 [应用化学];

摘要：

The influence of the molecular weight (Mw) of polyethylene glycol (PEG) on the microvia filling by copper electroplating was demonstrated and examined by cross-sectional images using an optical microscope. The electrochemical behavior of PEG of different molecule weights in the copper electroplating was characterized by galvanostatic measurement. In the presence of excess Cl-, the surface coverage of PEG of various Mw adsorbed on the copper surface was characterized by observing the size and distribution of CuCl precipitates using a scanning electron microscope. As PEG Mw was increased, the best filling performance of plating formula was obtained when the PEG Mw ranged from 6000 to 8000 g/mol. Only large PEG amounts whose Mw exceeds 2000 g/mol can effectively polarize the cathode, in turn inducing the catalytic effect of bis(3-sulfopropyl) disulfide on copper deposition, resulting in a synergistic interaction between the suppressor and accelerator on the microvia filling. (c) 2005 The Electrochemical Society.

引用

页码：C769 / C775

页数：7

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