Thermal characterization of microsystems by means of high-resolution thermography

被引:12
作者
Ashauer, M
Ende, J
Glosch, H
Haffner, H
Hiltmann, K
机构
[1] Inst. Mikro-und Informationstechnik, D-78052 Villingen-Schwenningen
关键词
D O I
10.1016/S0026-2692(96)00036-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thermal measurements on microsystems prove difficult due to small thermal masses and high thermal gradients, namely on thermally powered actuators. Compared with contacting thermometry or integration of thermally sensitive structures, thermography as a two-dimensional method may be a very powerful and exact method of measuring device temperatures and heat fields. The load capacity of interconnection lines, a bimetal micro actuator, and the development of a thermopneumatical actuator, are reported as examples for successful employment of infrared thermography in microtechnology. (C) 1997 Elsevier Science Ltd.
引用
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页码:327 / 335
页数:9
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