Advanced photoresist technologies for microsystems

被引：86

作者：

O'Brien, J ^{[1
]}

Hughes, PJ ^{[1
]}

Brunet, M ^{[1
]}

O'Neill, B ^{[1
]}

Alderman, J ^{[1
]}

Lane, B ^{[1
]}

O'Riordan, A ^{[1
]}

O'Driscoll, C ^{[1
]}

机构：

[1] NMRC, Cent Fabricat Grp, Microsyst Fabricat Unit, Cork, Ireland

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2001年 / 11卷 / 04期

关键词：

D O I：

10.1088/0960-1317/11/4/312

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A growing interest in the development of high aspect ratio photoresists for micromachining microsystems (MST) products has resulted in the availability of a number of commercially available photoresist products. This paper describes in detail the applications of three such resists, namely EPON SU-8, Clariant AZ 4562 and the Shipley electroplated photoresist ED2100. Applications such as etch hard masks, micromoulds, severe topography coatings for metal interconnects and photoplastic mouldings are discussed, and novel examples are presented of where these resists are currently used in both telecomm and microfluidic markets. In particular, the versatility of the photoplastic negative resist EPON SU-8, which is used in a number of MST prototypes, is demonstrated. Future trends in resist technologies for MST are discussed.

引用

页码：353 / 358

页数：6

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