Piezoresistive characteristics of short-channel MOSFETs on (100) silicon

被引:127
作者
Bradley, AT [1 ]
Jaeger, RC
Suhling, JC
O'Connor, KJ
机构
[1] Univ Tennessee, Dept Elect Engn, Knoxville, TN 37916 USA
[2] Auburn Univ, Dept Elect & Comp Engn, Auburn, AL 36830 USA
[3] Auburn Univ, Dept Mech Engn, Auburn, AL 36830 USA
[4] Bell Labs, Lucent Technol, Murray Hill, NJ 07974 USA
关键词
MOSFETs; (100) silicon; piezoresistance; short channel devices; threshold;
D O I
10.1109/16.944190
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper demonstrates that the intrinsic piezoresistive response of the MOSFET channel is independent of length. The reported fall-off of the piezoresistive response of the transistor in short channel devices is shown to be the result of parasitic series resistance in the source of the transistor. At the same time, the experimental results demonstrate that the threshold voltage of the devices is essentially independent of stress. The results are verified for three independent processes.
引用
收藏
页码:2009 / 2015
页数:7
相关论文
共 23 条
[1]   Stress-induced parametric shift in plastic packaged devices [J].
Ali, H .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1997, 20 (04) :458-462
[2]  
[Anonymous], P INT S VLSI TECHN S
[3]  
BASTOS J, 1996, P IEEE INT C MICR TE, P27
[4]   EVALUATION OF PIEZORESISTIVE COEFFICIENT VARIATION IN SILICON STRESS SENSORS USING A 4-POINT BENDING TEST FIXTURE [J].
BEATY, RE ;
JAEGER, RC ;
SUHLING, JC ;
JOHNSON, RW ;
BUTLER, RD .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (05) :904-914
[5]  
Bittle D. A., 1991, Transactions of the ASME. Journal of Electronic Packaging, V113, P203, DOI 10.1115/1.2905397
[6]  
BRADLEY AT, 1999, THESIS AUBURN U AUBU
[7]   MOBILITY ANISOTROPY AND PIEZORESISTANCE IN SILICON P-TYPE INVERSION LAYERS [J].
COLMAN, D ;
BATE, RT ;
MIZE, JP .
JOURNAL OF APPLIED PHYSICS, 1968, 39 (04) :1923-&
[8]   EFFECT OF STRAIN ON MOS TRANSISTORS [J].
DOREY, AP ;
MADDERN, TS .
SOLID-STATE ELECTRONICS, 1969, 12 (03) :185-&
[9]  
HAMADA A, 1990, P 1990 S VLSI TECHN, P113
[10]  
Jaeger R. C., 1993, Advances in Electronic Packaging 1993. Proceedings of the 1993 ASME International Electronics Packaging Conference, P457