A new micro-machined millimeter-wave and terahertz snap-together rectangular waveguide technology

被引：53

作者：

Collins, CE ^{[1
]}

Miles, RE ^{[1
]}

Digby, JW ^{[1
]}

Parkhurst, GM ^{[1
]}

Pollard, RD ^{[1
]}

Chamberlain, JM ^{[1
]}

Steenson, DP ^{[1
]}

Cronin, NJ ^{[1
]}

Davies, SR ^{[1
]}

Bowen, JW ^{[1
]}

机构：

[1] Univ Reading, Dept Cybernet, Reading RG6 6AY, Berks, England

来源：

IEEE MICROWAVE AND GUIDED WAVE LETTERS | 1999年 / 9卷 / 02期

基金：

英国工程与自然科学研究理事会;

关键词：

micro-machining; millimeter-wave; passive structures; photolithographic techniques; rectangular waveguide;

D O I：

10.1109/75.755047

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

A novel technique for micro-machining millimeter and submillimeter-wave rectangular waveguide components is reported. These are fabricated in two halves which simply snap together, utilizing locating pins and holes, and are physically robust, and cheap, and easy to manufacture. In addition, S-parameter measurements on these structures are reported for the first time and display lower loss than previously reported micro-machined rectangular waveguides.

引用

页码：63 / 65

页数：3

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