The direct patterning of nanoporous interlayer dielectric insulator films by nanoimprint lithography

被引:26
作者
Ro, Hyun Wook
Jones, Ronald L.
Peng, Huagen
Hines, Daniel R.
Lee, Hae-Jeong
Lin, Eric K.
Karim, Alamgir
Yoon, Do Y.
Gidley, David W.
Soles, Christopher L.
机构
[1] NIST, Div Polymers, Gaithersburg, MD 20899 USA
[2] Univ Michigan, Dept Phys, Ann Arbor, MI 48109 USA
[3] Univ Maryland, Lab Phys Sci, College Pk, MD 20740 USA
[4] Seoul Natl Univ, Dept Chem, Seoul 151747, South Korea
关键词
D O I
10.1002/adma.200602872
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Nanoscale parallel line-space patterns are imprinted into a spin-on organosilicate thin film that contains a second phase pore generating material (porogen). Imprints are converted into nanoporous low-dielectric patterns by vitrification at 430 degrees C where the porogen is volatilized and creates nanoscale pores (2.2 nm) in the vitrified organosilicate network (see figure). The results are well-defined, high-modulus, nanoporous patterns with an estimated dielectric constant of k-2.4.
引用
收藏
页码:2919 / +
页数:7
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