Advanced flash memory technology and trends for file storage application

被引:20
作者
Aritome, S [1 ]
机构
[1] Toshiba Corp, Flash Memory Dep, Sakae Ku, Yokohama, Kanagawa 2478585, Japan
来源
INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST | 2000年
关键词
D O I
10.1109/IEDM.2000.904429
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes a high density Flash memory technology suitable for file storage application. Requirements for file storage memory are low cost, high speed programming and erasing, low power consumption and good endurance characteristics. In order to satisfy these requirements, key technologies of Self-Aligned STI (SA-STI) cell, uniform FN-FN program/erase scheme and Multi-level-cell (MLC) technology have been developed[1,2,3]. By using SA-STI technology, small cell size of 4F(2) (F; Feature size) can be realized. Reliable tunnel oxide can be also obtained[3] because the floating gate does not overlap the STI corner. As a result, reliable 512Mbit Flash memories with 0.145um(2) cell size under 0.175um design rule have been newly developed based on these technologies, as well as 0.25um 256Mbit[4]. Moreover, MLC technology combined with this small cell size of 4F(2) can reduce bit cost more, and will be able to expand file storage market in the near future.
引用
收藏
页码:763 / 766
页数:4
相关论文
共 4 条
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ARITOME S, 1994, INTERNATIONAL ELECTRON DEVICES MEETING 1994 - IEDM TECHNICAL DIGEST, P61, DOI 10.1109/IEDM.1994.383466
[2]  
Aritome S., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P111, DOI 10.1109/IEDM.1990.237214
[3]  
IMANIYA K, 1999, ISSCC TECH PAPERS, P112
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