X-ray photoelectron spectroscopy study on the chemical composition of copper tarnish products formed at low humidities

被引：57

作者：

Cano, E ^{[1
]}

López, MF ^{[1
]}

Simancas, J ^{[1
]}

Bastidas, JM ^{[1
]}

机构：

[1] Natl Ctr Met Res, Madrid 28040, Spain

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2001年 / 148卷 / 01期

关键词：

D O I：

10.1149/1.1344547

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

This work studies the chemical composition of copper tarnish products formed at 40. 60. and 80% relative humidity (RH) in an uncontaminated environment, for 21 days experimentation at 30 degreesC. The experimental method used was X-my photoelectron spec troscopy (XPS) in conjunction with Ar+-ion sputtering. The main compounds found were cuprite (Cu2O) and copper hydroxide [Cu(OH)(2)]. Differences were observed between 40, 60, and 80% RH. Copper specimens exposed to 40% RH show the thickest tarnish layers, while the thinnest correspond to the 80% RH specimens. The tarnish layer of the copper specimen exposed to 80% RH is constituted mainly by copper hydroxide. For the 40 and 60% RH copper specimens the tarnish layer is a mixture of copper hydroxide and cuprite. (C) 2000 The Electrochemical Society. S0013-4651 (00)06-073-0. All rights: reserved.

引用

页码：E26 / E30

页数：5

共 24 条

[1] Copper corrosion mechanism in the presence of formic acid vapor for short exposure times [J].