Thin film encapsulation for flexible AM-OLED: a review

被引：414

作者：

Park, Jin-Seong ^{[1
]}

Chae, Heeyeop ^{[2
]}

Chung, Ho Kyoon ^{[2
]}

Lee, Sang In ^{[3
]}

机构：

[1] Dankook Univ, Anseo Dong 330714, Cheonan, South Korea

[2] Sungkyunkwan Univ SKKU, SKKU Adv Inst Nanotechnol SAINT, Suwon 440746, South Korea

[3] Synos Technol Inc, San Jose, CA 95131 USA

来源：

SEMICONDUCTOR SCIENCE AND TECHNOLOGY | 2011年 / 26卷 / 03期

关键词：

ATOMIC LAYER DEPOSITION; GAS-DIFFUSION BARRIERS; LIGHT-EMITTING-DIODES; SURFACE-CHEMISTRY; COATINGS; OXYGEN; AL2O3; METAL; POLYMERS; PERMEABILITY;

D O I：

10.1088/0268-1242/26/3/034001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Flexible organic light emitting diode (OLED) will be the ultimate display technology to customers and industries in the near future but the challenges are still being unveiled one by one. Thin-film encapsulation (TFE) technology is the most demanding requirement to prevent water and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance as glass, the TFE should be developed on both the bottom and top side of the device layers for sufficient lifetimes. This work provides a review of promising thin-film barrier technologies as well as the basic gas diffusion background. Topics include the significance of the device structure, permeation rate measurement, proposed permeation mechanism, and thin-film deposition technologies (Vitex system and atomic layer deposition (ALD)/molecular layer deposition (MLD)) for effective barrier films.

引用

页数：8

共 87 条

[1] Molecular layer deposition of poly(p-phenylene terephthalamide) films using terephthaloyl chloride and p-phenylenediamine [J].