Micromachining techniques for liquid crystal polymer

被引:16
作者
Wang, XF [1 ]
Lu, LH [1 ]
Liu, C [1 ]
机构
[1] Univ Illinois, Dept Elect & Comp Engn, Microelect Lab, Urbana, IL 61801 USA
来源
14TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2001年
关键词
D O I
10.1109/MEMSYS.2001.906495
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports newly developed microfabrication techniques for liquid crystal polymer (LCP) for the first time. LCP is a thermal plastic polymer with regularly aligned molecule chains. It exhibits excellent electrical, physical, and chemical properties, which make it suitable for many MEMS applications. The chemical compatibility of LCP with commonly used chemicals is investigated in this work. MEMS fabrication processes such as metallization, plasma hulk etching, and low temperature thermal lamination have been developed. These micromachining techniques are successfully demonstrated by the development of a microfluid channel system composed of LCP/glass assembly.
引用
收藏
页码:126 / 130
页数:3
相关论文
共 9 条
[1]   ANALYSIS OF CRITICAL DEBONDING PRESSURES OF STRESSED THIN-FILMS IN THE BLISTER TEST [J].
ALLEN, MG ;
SENTURIA, SD .
JOURNAL OF ADHESION, 1988, 25 (04) :303-315
[2]  
AMANI D, 1999, 12 IEEE INT C MICR E, P222
[3]  
CHROSINSKI L, 2000, LOW COST LIGHTWEIGHT
[4]  
CULBERTSON EC, 1995, ELEC COMP C, P520, DOI 10.1109/ECTC.1995.515331
[5]  
GU B, 1995, P MULT CHIP MOD C
[6]   Laser processing of adhesives and polymeric materials for microelectronics packaging applications [J].
Illyefalvi-Vitéz, Z .
4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS, 2000, :289-295
[7]  
JAYARAJ K, 1998, ADV MICROELECTRO JUL, P15
[8]   Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer [J].
Jo, BH ;
Van Lerberghe, LM ;
Motsegood, KM ;
Beebe, DJ .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2000, 9 (01) :76-81
[9]  
Khoo C. G. L., 1997, IEEE Transactions on Components, Packaging & Manufacturing Technology, Part C (Manufacturing), V20, P219, DOI 10.1109/3476.649445