Wafer-level in-registry microstamping

被引:24
作者
Folch, A [1 ]
Schmidt, MA [1 ]
机构
[1] MIT, Microsyst Technol Lab, Cambridge, MA 02139 USA
基金
美国国家科学基金会;
关键词
D O I
10.1109/84.749407
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Microstamping is an inexpensive technique that allows for micrometer-scale patterning of a rich variety of materials by a replication procedure based on an elastomeric stamp, We have investigated the scalability of microstamping for its use in the fabrication of microelectromechanical systems. Until now, the application of microstamping to multilayer processing at a wafer level has been impaired by the flexibility of the stamp, By mounting the stamp onto a rigid glass surface, we demonstrate the feasibility of in-registry multilayer microstamping at a 4-in wafer level. [287].
引用
收藏
页码:85 / 89
页数:5
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